Plain-Weave Conductive Fabric Tape

1. Product Introduction

Plain-Weave Conductive Fabric Tape is a flexible self-adhesive shielding material made from metal-plated textile coated with conductive pressure-sensitive adhesive. Designed for electronic and electrical applications, it combines electrical conductivity, electromagnetic interference (EMI) shielding, and electrostatic discharge (ESD) protection in a thin, conformable tape structure.

Available in single-sided and double-sided configurations, this conductive tape can be selected for different bonding and electrical connection requirements. Its flexible textile substrate adapts to curved surfaces, narrow gaps, and irregular component geometries, making it suitable for applications where rigid shielding materials are difficult to install.

The conductive adhesive layer supports electrical contact between surfaces and can provide Z-axis conductivity or broader conductive contact, depending on the selected construction. With abrasion resistance, anti-oxidation treatment, and good processability, the tape is designed to support reliable shielding and grounding in electronic assemblies.

Manufactured by Hangchen Technology, the tape is suitable for EMI shielding, cable interference reduction, component grounding, temporary circuit bridging, and electronic enclosure applications. Customized dimensions and processing options can be discussed according to project requirements.

2. Key Features and Advantages

2.1 Effective EMI Shielding Performance

The metal-plated textile substrate and conductive adhesive structure help block electromagnetic interference in electronic assemblies. The specified shielding effectiveness is at least 70 dB within the 30 MHz–10 GHz frequency range, supporting applications that require electromagnetic compatibility management.

2.2 Good Electrical Conductivity

The conductive substrate provides a low-resistance electrical path for grounding and shielding applications. The tape can help establish electrical contact between compatible conductive surfaces, subject to the selected adhesive construction and application conditions.

2.3 Z-Axis Conductivity

The conductive adhesive layer is designed to support through-thickness electrical conduction. This characteristic is useful for applications requiring electrical contact between overlapping or adjacent conductive components.

2.4 Flexible and Conformable Structure

The soft textile construction allows the tape to adapt to curved surfaces, narrow gaps, and irregular shapes. This flexibility supports installation in compact electronic devices and complex assemblies where conventional rigid shielding components may be unsuitable.

2.5 Abrasion and Oxidation Resistance

The tape features abrasion resistance and anti-oxidation treatment to help maintain surface performance during handling and use. These properties support applications involving repeated assembly operations or contact with adjacent components.

2.6 Strong Adhesion and Holding Performance

The specified adhesion is at least 1100 gf/25 mm, while holding power is at least 24 hours under the applicable test conditions. These properties help the tape remain attached to compatible surfaces during assembly and operation. Actual bonding performance depends on the substrate, surface cleanliness, temperature, and application conditions.

2.7 Clean Slitting and Easy Processing

The tape supports clean slitting without burrs and offers good processability for converting operations. It can be considered for die-cutting, customized shapes, and integration into electronic component assembly workflows, subject to the manufacturer's available processing capabilities.

2.8 Fingerprint and Dirt Resistance

The treated surface helps resist fingerprints and dirt during handling, supporting cleaner assembly processes and a more consistent material appearance.

2.9 Environmental Compliance Considerations

The product is described as meeting relevant environmental requirements, including applicable halogen requirements, EU RoHS, and REACH. Buyers should request current compliance documentation for the specific product construction and intended market before placing an order.

3. Technical Specifications

Note: Confirm the resistance measurement method, test conditions, adhesive construction, and compliance documentation with the supplier. Final performance may vary according to the selected tape configuration and application environment.

4. Typical Applications

Plain-Weave Conductive Fabric Tape is used in electronic assemblies and industrial equipment where conductive bonding, grounding, or electromagnetic shielding is required.

• Electronic mainboards: EMI shielding and grounding around compatible circuit board areas.

• Cable shielding: Reducing electromagnetic interference from cables and cable connection areas.

• Electronic component protection: Supporting ESD control and conductive contact in suitable assemblies.

• Temporary circuit bridging: Establishing temporary electrical connections where the design and application permit.

• Electronic enclosure sealing: EMI shielding around device cavities, seams, and enclosure gaps.

• Automotive electronics: Supporting noise reduction and electromagnetic shielding in electronic modules.

• Communication equipment: Shielding and grounding in communication devices and related assemblies.

• Industrial control equipment: Conductive shielding for compatible control systems and electronic housings.

• Electronics repair and assembly: Flexible conductive material for selected repair, bonding, and shielding tasks.

Application suitability depends on operating voltage, current, temperature, mechanical stress, substrate compatibility, and the required shielding performance.

5. Single-Sided and Double-Sided Options

The tape is available in single-sided and double-sided constructions to accommodate different installation and bonding requirements.

Single-sided conductive fabric tape

Suitable for applications where conductive adhesive is required on one side for attachment and electrical contact. It can be considered for grounding, shielding, and conductive bonding to compatible surfaces.

Double-sided conductive fabric tape

Suitable for applications that require bonding between two surfaces while maintaining conductive contact. The exact conductivity path and bonding performance depend on the tape construction.

When selecting a configuration, confirm the required contact surfaces, conductivity direction, adhesive performance, thickness, and installation method with the supplier.

6. Why Choose Hangchen Technology?

Hangchen Technology was founded in 2016 and focuses on the research, development, manufacturing, and sales of flexible electronic materials. Its product development activities include conductive fabrics, conductive coatings, nano-copper-carbon composites, and EMI shielding films.

Manufacturing and R&D Capabilities

• Production facilities: Two standardized production facilities in Dongguan and Henan.

• Material technology: Development of conductive and electromagnetic shielding materials.

• Intellectual property: Nearly 20 industry patents, including multiple national invention patents.

• Registered trademarks: Two registered trademarks.

• Customization support: Experience in precision processing and customized material solutions.

• International service development: Foreign trade and overseas technical service teams supporting international customers.

Quality and Application Support

Hangchen serves electronics manufacturers and die-cutting enterprises, with materials intended for consumer electronics, automotive electronics, telecommunications infrastructure, and industrial applications.

The company emphasizes stable product quality, precision processing, responsive customization, and continued material technology development. Buyers can provide their required thickness, tape configuration, shielding target, resistance requirements, and application details to discuss a suitable product specification.

7. Product Selection Guide

To select the appropriate conductive fabric tape, consider the following parameters:

Tape configuration: Specify single-sided or double-sided construction according to the bonding and conductivity requirements.

Thickness: Select a thickness between 0.03 mm and 0.2 mm based on the available installation space and mechanical requirements.

Electrical resistance: Confirm the required X-Y and Z-axis resistance values and ensure the supplier's test method matches the project's evaluation criteria.

Shielding performance: Check the required shielding effectiveness and frequency range against the equipment's EMI requirements.

Adhesion and holding power: Consider the substrate material, surface finish, operating temperature, and expected mechanical loading.

Processing requirements: Specify roll dimensions, die-cut shapes, slitting tolerances, and other converting requirements when applicable.

Environmental compliance: Request the relevant RoHS, REACH, and halogen-related declarations for the exact product configuration.

Providing these details helps the supplier evaluate compatibility and recommend an appropriate tape specification.

8. Frequently Asked Questions

Q1: What is plain-weave conductive fabric tape?

It is a self-adhesive conductive tape made from metal-plated textile coated with conductive pressure-sensitive adhesive. It is used for EMI shielding, grounding, and other electrical contact applications.

Q2: What shielding performance does the tape provide?

The specified shielding effectiveness is at least 70 dB across the 30 MHz–10 GHz frequency range. Actual results depend on the installation, contact quality, enclosure design, and test conditions.

Q3: What thicknesses are available?

The stated thickness range is 0.03–0.2 mm. Confirm the required thickness and tolerances for the intended application.

Q4: Does the tape support Z-axis conductivity?

Yes. The product specification includes a Z-axis resistance of ≤0.05 Ω/in². Buyers should confirm the measurement method and the conductivity behavior of the selected construction.

Q5: Can the tape be used on curved surfaces?

Its soft, flexible textile structure is designed to conform to curved surfaces, narrow gaps, and irregular geometries. Surface preparation and bending conditions should be evaluated to maintain adequate adhesion and electrical contact.

Q6: Is it available in single-sided and double-sided versions?

Yes. Both single-sided and double-sided options are listed. The suitable type depends on the required bonding arrangement and electrical connection path.

Q7: Does the product meet RoHS and REACH requirements?

The product information states compliance with relevant environmental requirements, including EU RoHS, REACH, and applicable halogen requirements. Request current declarations or test documentation to verify compliance for the exact product configuration.

Q8: Can customized sizes or die-cut shapes be requested?

The product is described as having good processability and clean slitting characteristics. Discuss the required dimensions, converting method, and tolerances with Hangchen Technology to confirm available customization options.

9. Request a Quote

For electronic assemblies requiring flexible EMI shielding, conductive bonding, grounding, or ESD protection, Plain-Weave Conductive Fabric Tape offers a thin and adaptable material solution with single-sided and double-sided options.

Contact Hangchen Technology with your required thickness, tape construction, resistance targets, shielding frequency range, dimensions, and application details to confirm product suitability and request a quotation.